Double-Sided Grinding and Polishing Equipment for Wafer Parts

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show

Main uses:
The equipment is mainly used for grinding and polishing the upper and lower parallel end faces of sapphire substrate, aluminum sheet, ceramic sheet, optical glass, quartz crystal, other semiconductor materials and other hard brittle materials of non-metal and metal thin precision parts.
Working principle and characteristics
1, innovation is the basic concept of the design, the equipment in the design carefully analyzed and compared the structure of similar equipment at home and abroad, control and functional characteristics, comprehensive, concluded and adopted the successful experience of many users and reasonable suggestions. Efforts are made to improve the technical content, operation accuracy and operation stability of the equipment.
2, the use of advanced Siemens PLC program controller, control the action of the machine, high degree of automation, and matched by Siemens Smart 700 large screen touch screen interface, display the current state of the machine, man-machine dialogue, operation at a glance.
3, the use of frequency control and full gear drive, so that the whole machine work when starting stable, stable operation, especially at low speed operation, to overcome the upper and lower grinding disk movement, crawling phenomenon.
4. The pneumatic actuator produced by Yadeke and the pneumatic control component produced by SMC are used to realize the stepless pressure regulation of the grinding disc in four stages, namely light pressure, medium pressure, heavy pressure and fine, so as to provide more excellent grinding efficiency and wider grinding process selection for the grinding workpiece.
5, the big gear ring can be lifted, and the lifting position can be adjusted. The height of the sun wheel can also be adjusted by periodically increasing or decreasing the number of shims.
6, equipped with automatic lubrication equipment to lubricate the gear.
7, This equipment can set and store 30 sets of different process parameters (pressure, speed, time, turn number) for users to choose.
8, equipped with the main cylinder end lock mechanism, can be convenient and safe to lock the upper grinding disc.
APPLICATION

Process	Industry by Substance	Industry by Applicability
Double Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed.

SPECIFICATION

Standard Specification
Machine Model	FD6B		FD9B		FD13-6B
Lower Plate Diameter	Φ386 mm / 15 inches		Φ640 mm / 25 inches		Φ973 mm / 38 inches
Upper Plate Diameter	Φ386 mm / 15 inches		Φ640 mm / 25 inches		Φ973 mm / 38 inches
Star Wheel Parameter	DP 12, Z=66, A=20°		DP 12, Z=108, A=20°		DP 19.3, Z=152, A=20°
Conditioning Ring Parameter	DP 12, Z=66, A=20°		DP 12, Z=108, A=20°		DP 19.3, Z=152, A=20°
Max. Workpiece Diameter	Φ120 mm		Φ180 mm		Φ290 mm
Process Thickness	0.2mm≤N≤20mm		0.2mm≤N≤25mm		0.2mm≤N≤30mm
Number of Station	3≤N≤5		3≤N≤5		3≤N≤5
Plate Rotate Speed	0-60 rpm		0-60 rpm		0-50 rpm
Total Weight	600 kg		2000 kg		3200 kg
Total Floor Space	700×950 mm		1350x960 mm		1700×1380 mm
Built-In Optional Kits
Grade		Standard		Advanced
Slurry Supply System		-		Integrated with PLC
Facing and Grooving System		-		Integrated with PLC
Machine Enclosure		-		Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (DOUBLE PLATE)
Patent
About the Company Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

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