Shenzhen Optical Lens Glass Wafer One - Side Grinding Machine

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
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How it works:
1. The grinding machine is a precision grinding and polishing equipment, the grinding and polishing materials are placed on the grinding disc, the grinding disc rotates against the clock, the correction wheel drives the workpiece to rotate, the gravity pressure is applied to the workpiece, and the workpiece and the grinding disc are relative running friction to achieve the purpose of grinding and polishing.
2. The dressing mechanism of the grinding disc adopts the reciprocating motion of the oil pressure suspended guide rail, and the diamond shaving knife trims the grinding surface of the grinding disc precisely to obtain the ideal plane effect.
Special points:
1. Usually the traditional way of polishing plate is to use electroplating wheel to shave, this way to get the shaving effect is not ideal. The error will be tens of microns or even hundreds of microns, and the flatness of the grinding disc can reach ±0.002mm after the finishing machine. The flatness of the workpiece after processing can reach ±0.0005mm (φ50mm).
2. Series grinding machine parts are pressurized by pressing the weight block,

Main uses:
This equipment is widely used in LED sapphire substrate, optical glass wafers, quartz wafers, molds, compressor valves, hydraulic seals, light guide plates, light picker joints and other materials single-sided grinding, polishing.
APPLICATION

Process	Industry by Substance	Industry by Applicability
Single Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Phone Frame(flat)	back plate
		PCB	adhesive, coating, circuit
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Radar	oxide coating plate
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION

Standard Specification
Machine Model	FD3803		FD4603		FD6103		FD9104
Plate Diameter	Φ380 mm / 15 inches		Φ460mm / 18 inches		Φ610mm / 24 inches		Φ910mm / 36 inches
Max. Workpiece Diameter (without conditioning ring)	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Conditioning Ring Diameter	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Number of Station	3		3		3		4
Plate Rotate Speed	0-140 rpm		0-140 rpm		0-120 rpm		0-90 rpm
Facing & Grooving Speed (Not include in Polishing)	0-120 mm/m		0-120 mm/m		0-120 mm/m		0-120 mm/m
Total Weight	450 kg		780 kg		1000 kg		1600 kg
Total Floor Space	670×940 mm		1030×730 mm		1920×840 mm		2100×1300 mm
Built-In Optional Kits
Grade		Standard		Upgraded		Advanced
Controls		Digital		Digital		Touch-Screen PLC
Pressure Source		Hand Weight Block		Pneumatic Weight Block Manual		Pneumatic Press Integrated with PLC
Slurry Supply System		-		Manual		Digital, Manual
Cylinder Bar Drive System		-		Manual		Integrated with PLC
Conditioning Ring Drive System		-		Manual		Integrated with PLC
Machine Enclosure		-		Framed by Aluminum Alloy		Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)
Patent
About the Company
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its supporting products and consumable materials We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people

Delivery & Packing
Packing Details : Packing, 1 pcs/Wooden box.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

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