US$8,000.00-20,000.00
|
1 Piece
(MOQ)
|
Basic Info.
Type
Surface Grinding Machine, Lapping Machine
Processing Object
Flat Workpieces
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Material
Metal and Non-Metal
Disc Diameter
Φ610 mm / 24 Inches
Service
Oversea Setup & After-Sale Avalaible
Pressure Source
Pneumatic or Weight Block
Plate Material
Metal & Non-Metal
Transport Package
Wood Crate
Production Capacity
500 Unit/Year
Product Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Scope of application:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, molds, light guide plate, light joint and other materials of single-side grinding.Scope of application:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, molds, light guide plate, light joint and other materials of single-side grinding.
Products Show
Special points:
1. Usually, the way of grinding disc shaving is to use electroplating dressing wheel to shave, which is not ideal. After shaving by dressing mechanism, the flatness can reach ±0.002mm
2. Series grinding machine workpiece pressure using cylinder pressure, pressure can be adjusted;
3. Series grinding machine using PLC program control system, touch screen operation panel, grinding disk speed and timing can be directly input on the touch screen.
APPLICATION
Process | Industry by Substance | Industry by Applicability |
Single Plate Lapping & Polishing | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | valve and sealing ring(liquid, oil, gas) |
Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR |
Phone Frame(flat) | back plate |
PCB | adhesive, coating, circuit |
Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass |
Radar | oxide coating plate |
Gemstone | jade, sapphire, agate, etc. |
Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. |
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed. |
SPECIFICATION
Standard Specification |
Machine Model | FD3803 | FD4603 | FD6103 | FD9104 |
Plate Diameter | Φ380 mm / 15 inches | Φ460mm / 18 inches | Φ610mm / 24 inches | Φ910mm / 36 inches |
Max. Workpiece Diameter (without conditioning ring) | Φ180 mm | Φ220 mm | Φ270 mm | Φ420 mm |
Conditioning Ring Diameter | Φ180 mm | Φ220 mm | Φ270 mm | Φ420 mm |
Number of Station | 3 | 3 | 3 | 4 |
Plate Rotate Speed | 0-140 rpm | 0-140 rpm | 0-120 rpm | 0-90 rpm |
Facing & Grooving Speed (Not include in Polishing) | 0-120 mm/m | 0-120 mm/m | 0-120 mm/m | 0-120 mm/m |
Total Weight | 450 kg | 850 kg | 1000 kg | 1600 kg |
Total Floor Space | 670×940 mm | 1030×730 mm | 1920×840 mm | 2100×1300 mm |
Built-In Optional Kits |
Grade | Standard | Upgraded | Advanced |
Controls | Digital | Digital | Touch-Screen PLC |
Pressure Source | Hand Weight Block | Pneumatic Weight Block Manual | Pneumatic Press Integrated with PLC |
Slurry Supply System | - | Manual | Digital, Manual |
Cylinder Bar Drive System | - | Manual | Integrated with PLC |
Conditioning Ring Drive System | - | Manual | Integrated with PLC |
Machine Enclosure | - | Framed by Aluminum Alloy | Framed by Metal Plate |
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
SAMPLE DEMONSTRATION
Company profile
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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