US$8,000.00-240,000.00
|
1 Piece
(MOQ)
|
Basic Info.
Type
Surface Grinding Machine, Lapping Machine
Processing Object
Flat Workpieces
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Grinding Industry
Material
Metal and Non-Metal
Service
Oversea Setup & After-Sale Avalaible
Pressure Source
Pneumatic or Weight Block
Plate Material
Metal & Non-Metal
Transport Package
Wood Crate
Specification
950*1600*2000
Production Capacity
500 Unit/Year
Product Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Particular point:
1. The upper and lower grinding disks of this series of grinding machines can be repaired automatically.
2. The four motors are used to drive synchronously, the speed change range is wider, the motion accuracy is higher, the response speed is faster, can adapt to the requirements of different grinding materials and grinding process, the soft start, soft stop, the speed is stable, the impact is small.
3. The shaving machine is driven by servomotor, which can ensure the sliding of the hydraulic suspension guide is more stable and the plane dressing effect is not good.
4. The control system adopts DSP, Web-Link, color terminal and other advanced technologies, the system response speed is faster, more accurate, and has remote monitoring, remote maintenance functions;
5. This series of grinding machine has grating thickness control system, the thickness tolerance of processed products can be controlled within the range of ±0.002mm.
APPLICATION
Process | Industry by Substance | Industry by Applicability |
Single Plate Lapping & Polishing | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | valve and sealing ring(liquid, oil, gas) |
Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR |
Phone Frame(flat) | back plate |
PCB | adhesive, coating, circuit |
Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass |
Radar | oxide coating plate |
Gemstone | jade, sapphire, agate, etc. |
Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. |
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed. |
SPECIFICATION
Standard Specification |
Machine Model | FD6B | FD9B | FD13-6B |
Lower Plate Diameter | Φ386 mm / 15 inches | Φ640 mm / 25 inches | Φ973 mm / 38 inches |
Upper Plate Diameter | Φ386 mm / 15 inches | Φ640 mm / 25 inches | Φ973 mm / 38 inches |
Star Wheel Parameter | DP 12, Z=66, A=20° | DP 12, Z=108, A=20° | DP 19.3, Z=152, A=20° |
Conditioning Ring Parameter | DP 12, Z=66, A=20° | DP 12, Z=108, A=20° | DP 19.3, Z=152, A=20° |
Max. Workpiece Diameter | Φ120 mm | Φ180 mm | Φ290 mm |
Process Thickness | 0.2mm≤N≤20mm | 0.2mm≤N≤25mm | 0.2mm≤N≤30mm |
Number of Station | 3≤N≤5 | 3≤N≤5 | 3≤N≤5 |
Plate Rotate Speed | 0-60 rpm | 0-60 rpm | 0-50 rpm |
Total Weight | 600 kg | 2000 kg | 3200 kg |
Total Floor Space | 700×950 mm | 1350x960 mm | 1700×1380 mm |
Built-In Optional Kits |
Grade | Standard | Upgraded | Advanced |
Controls | Digital | Digital | Touch-Screen PLC |
Pressure Source | Hand Weight Block | Pneumatic Weight Block Manual | Pneumatic Press Integrated with PLC |
Slurry Supply System | - | Manual | Digital, Manual |
Cylinder Bar Drive System | - | Manual | Integrated with PLC |
Conditioning Ring Drive System | - | Manual | Integrated with PLC |
Machine Enclosure | - | Framed by Aluminum Alloy | Framed by Metal Plate |
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
SAMPLE DEMONSTRATION (SINGLE PLATE)
Patent
About the Company Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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