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Green Protective Film Al Ccl Aluminum Copper Clad Laminate for LED PCB

US$15.00-30.00 250 sheet (MOQ)

Basic Info.

Model NO.
Aluminum base
Application
Consumer Electronics
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Production Process
Additive Process
Base Material
Aluminum
Insulation Materials
Rcc
Brand
Hjh
Sheet Thickness
0.6-2.0mm
Copper Thickness
15um, 18um, 25um, 35um, 70um, Others
Protective Film Color
Green
Thermal Conductivity
0.6~2.0W
Aluminum Base Material
1060 / 5052
Tg (DSC)
>130 Degree
Breakdown Voltage
AC>/=5kv
Transport Package
Pallet
Specification
1000*1200MM, 500*600MM, others
Trademark
HJH
Origin
China
HS Code
7410211000
Production Capacity
200000 Sheets Per Month

Packaging & Delivery

Package Size
123.00cm * 103.00cm * 58.00cm
Package Gross Weight
1343.000kg

Product Description

Aluminum Copper Clad Laminate Sheet
This kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.
Properties
High mechanical strength and dimensional stability,
Excellent heating radiating,
Good electric magnetic shield,
Easy machinery cutting
Applications
Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.
Specifications
AL base materials: 1060, 5052 Sheet Thickness: 0.6~2.0mm
Copper thickness: 15um, 18um, 25um, 35um, 70um, others
Usual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mm Thermal conductivity: 0.6W/m.K, 0.8W/m.K, 1.0W/m.K, 1.5W/m.K, 2.0W/m.K Protective film: blue film (80ºC), green film (160ºC)
Main Technical Characteristics
Items Unit Test condition Typical values
AF-01 AF-04 AF-05
Peel strength N/mm At normal: A 2.00 1.05 1.08
After thermal stress 1.80 1.05 1.05
Surface resistance At normal 5.0 x 107 5.0 x 107 3.6 x 107
Constant humidity treatment 2.0 x 106 4.5 x 106 3.3 x 106
Volume resistance MΩ·m At normal 4.0 x 108 1.0 x 108 4.2 x 108
Constant humidity treatment 5.0 x 107 1.9 x 107 3.1 x 107
Thermal resistance ºC/w At normal 1.0 0.65 0.45
Dielectric Constant @ 1 MHz -- 40ºC, 93%, 96h 4.2 4.2 4.2
Dielectric dissipation factor @1 MHz -- 40ºC, 93%, 96h 0.02 0.029 0.033
Thermal stress min 260ºC 2 min, no delamination, no air bulb
Dielectric breakdown KV/MM At normal 31 31 60
Flammability -- At normal FV-0
Thermal-conductive factor W/m·k At normal 1.0 1.5 2.2


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