Diamond Wire Cutting Tool for Sapphire Silicon Materials Processing Machine

Product Description

Product Description
DA300 Multi-wire Saw
This series is mainly used for high-precision cutting of silicon carbide crystals, with advantages of large loading capacity and high wire speed ensuring high precision and high reliability, and achieving a significant increase in production capacity.
It can cut materials in 4~8 inches, the cutting size is flexible according to customers' requirements.
Product Features
>Processing Size
3 wire guide rollers, the maximum processing size can be 8 inches.
>Flexibility
The cutting wire can be flexibly change between slurry and diamond wire to meet different requirements from customers.
>Stability
The take-up and pay-off spools are under the cutting room, it's more stable during machine running.
>High-speed Cutting
The machine is equipped with an upside-down swing cutting structure, which facilitates high-speed sheet cutting.
>Stable Wire Arrangement System
Better design of the guide wheel distance and high-precision detection of wire arrangement, reduce the risk of wire breakage.
>Advanced Tension System
More advanced tension control algorithm and high precision tension sensor.
Cut Samples

Product Parameters

Detail	Parameter
Model	DA300
Maximum work size	φ205x300mm
Workbench quantity	1
Roller out diameter*Workable width	(φ200±10mm)310x3
Wire diameter	φ0.10-φ0.25mm
Wire spool storage	40km(φ0.25mm)
Maximum running speed	2400m/min
Travel of table	300mm
Table swing	±10°
Cutting method	Vertically downward movement
Cutting feed speed	0.1-99.9mm/min
Tension range	5-50N
Tension system accuracy(during cutting)	±0.5N
Cutting fluid	Water-based cutting fluid
Fluid storage	420L
Fluid flow rate	12000L/H
Power supply	380V±10% 50HZ
Power	120Kw
Air supply	≥0.4MPa
Size L*W*H	4000x1600x3200mm
Weight	12000kg

About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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